Tagasi

Protsessoreid on valmistatud erinevatesse korpustesse, siin on mõned pildid.

DIP (Dual In-Line Package)

PDIP (Plastic Dual In-Line Package)
CDIP / CERDIP (Ceramic Dual In-Line Package)

QFP (Quad Flat Package)

PQFP (Plastic Quad Flat Package)
TQFP (Thin Quad Flat Package)

LCC (Leadless Chip Carrier)
PLCC (Plastic Leaded Chip Carrier)

PGA (Pin Grid Array)

PPGA (Plastic Pin Grid Array)
OPGA (Organic Pin Grid Array)
FC-PGA (Flip Chip Pin Grid Array)
FC-PGA 2 (Flip Chip Pin Grid Array with Heat Spreader)

Slot

SECC (Single Edge Contact Cartridge)
SECC 2 (Single Edge Contact Cartridge, Type 2 w/o Metal Cover)
SEP (Single Edge Processor)

Tagasi